China WLCSP offers a wide variety of co-design services  to  semiconductor  manufacturers ,  design houses ,  and  module  makers ,  enabling  them  to  integrate  the  benefits  of  wafer-level  chip   size packaging into product designs from the earliest stage.
Typically, a co-design project includes several stages, in which  China  WLCSP's  engineers  work  in close coordination with the customer to facilitate the optimal packaging design.
In  the  first  stage ,  China  WLCSP  conducts  a  design   feasibility   study ,   defines   the   packaging specifications, and then prepares for the layout design. Following the  customer's  modifications  and approval, a full mask set is designed and sent to production. Prototype wafers are then produced and evaluated by the customer. The final, optional stage,  is  industrialization ,  in  which  China  WLCSP provides the customer with a qualified batch of wafers, based on the yield and reliability targets set in an earlier stage.
For more information on China WLCSP's co-design services, please contact us.