China   WLCSP   provides   contract-packaging   services   for   its   ShellOP ,   ShellOC   and   ShellUT technologies  from  Shellcase.
China WLCSP utilizes Shellcase's technology, a wafer scale packaging  methodology,  which  means that the company packages the entire wafer at one time, rather than packaging individual diced chips. This process results in noticeable economies of scale and significant cost savings by enabling wafer level testing. Additional benefits of Shellcase's technology include lower costs of
assembly and board space savings.
Shellcase's ShellOP, ShellOC and ShellUT platforms  are  the  only  wafer  level  chip  size  packaging technologies  available  today  for  CMOS  and  CCD  linear  and  array  image  sensor  light  detection applications. The ShellOP ,  ShellOC  and  ShellUT  packages  offers  many  advantages  including  a unique form factor design, superior optical performance and  reduced  over-all  device  and  complete module assembly costs. Both platforms can be found in a number of end user applications including
hand held electronics, including mobile camera phones, 2D scanners, professional digital cameras, disposable medical applications and others.
China  WLCSP's  contract-packaging  services  are  available  for  its  ShellOP,  ShellOC  and ShellUT packages, both for 6" and 8" wafers. The manufacturing capacity   is  10,000-15,000  wafers/month.
QUALIFICATION OF YOUR PACKAGED SEMICONDUCTOR DEVICE:
The package qualification process is relatively fast and simple, and can  take  as  little  as  6-8  weeks from the beginning  of  package  design to  delivery  of  the  first  packaged  wafers.  After  receiving  all details about the wafer and die, China WLCSP presents a layout for the package. Following customer approval  of the  package ,  tooling  is  ordered  and  the  first  wafers  are   processed .  Within   a   few
weeks, the first packaged wafers are sent to the customer for evaluation.
When moving to production, the  same  tooling  setup  can  be  used ,  providing  the  package  design remains unchanged.
Please contact us for more details on contract packaging.