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ShellOCTM
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The First
Wafer-Level Chip Size Packaging Cavity Technology |
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ShellOC™ is a true
die size package that utilizes an
innovative glass-silicon-glass sandwich to enable
image-sensing capabilities through the actual packaging
structure . ShellOC™'s innovation is an air
cavity between the package and the
die.ShellOC™ is thus the packaging solution of choice
for image sensors with micro-lenses , enabling
enhanced image quality . ShellOC™ is the packaging
technology of choice for several different types of
applications , including the newest generation of
digital cameras and camera phones,fax machines and digital
scanners ,machine vision applications , and CD/DVD portable
units , among others.
Benefits
， Economies of scale enabled by wafer-level packaging and
testing
， Miniaturization: True die size (X/Y) and low Z-height
， High yields: Die protected from contamination from stage one
of the process
， Versatility: Flexible package design and structure, ability to
incorporate filters
， Standard SMT assembly: BGA and LGA compatible
， Superior quality: Mature, proven technology
Features
， Optical properties are characterized by a glass cover with a
transmittance of
91.2% in the 350-900nm range
， Custom package size and pin count
， Extremely accurate die rotation control during assembly (max.
<＼ 0.01 ＜)
， Precise die tilt control of <0.5mil during assembly.
， Termination type: BGA or LGA |
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ShellOP