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ShellOPTM
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The First
Wafer-Level Chip Size Packaging Technology |
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ShellOP™ utilizes an innovative
glass-silicon-glass sandwich structure to enable
image-sensing capabilities through the actual packaging
structure . The end result is a true die size package with X/Y
dimensions identical to the original die size , and a total
package thickness of 630-730 um, which is in most cases
similar to the original silicon thickness . ShellOP™
is offered in two configurations: "face up" , where the
assembled die faces up towards the target image ; or
"face down" where the assembled die captures the target
image through a port in the printed circuit board.
ShellOP™'s unique features offer significant advantages for
CMOS and CCD linear and array image sensors ,
digital imaging and light detection applications .
ShellOP™ has been in commercial production since 2000 , and
can be found in a wide variety of devices , including camera
phones , digital cameras and medical
devices.
Benefits
， Economies of scale enabled by wafer-level packaging and
testing
， Miniaturization: True die size (X/Y) and low Z-height
， High yields: Die protected from contamination from stage one
of the process
， Versatility: Flexible package design and structure, ability to
incorporate filters
， Standard SMT assembly: BGA and LGA compatible
， Superior quality: Mature, proven technology
Features
， Optical properties are characterized by a glass cover with a
transmittance of
91.2% in the 350-900nm range
， Custom package size and pin count
， Extremely accurate die rotation control during assembly (max.
<＼ 0.01 ＜)
， Precise die tilt control of <0.5mil during assembly.
， Termination type: BGA or LGA |
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ShellOP