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ShellUTTM
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Next Generation
UltraThin and Cost Effective Technology |
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ShellUltraThin is Shellcase¨s
next generation ultra thin and cost effective platform for image
sensors and other optical chips . ShellUT™ utilizes an
innovative glass-silicon structure to enable image-sensing
capabilities through the packaging
structure , allowing for the use of
micro-lenses . In ShellUT™, the bottom side of
the wafer is encapsulated using a polymer . ShellUT™
answers the latest advances in the semiconductor industry
where metal contact thickness has been reduced to 0.5 um .
Like ShellOC and ShellOP™, the end
result is a true die-sized
package with X/Y dimensions identical to
the original chip size , and a total package thickness
smaller than the original silicon thickness.
ShellUT™ is available in both cavity and non-cavity formats.
Benefits
， Economies of scale enabled by wafer-level packaging and
testing
， Miniaturization: True die size (X/Y) and low Z-height
， High yields: Die protected from contamination from stage one
of the process
， Versatility: Flexible package design and structure, ability to
incorporate filters
， Standard SMT assembly: BGA and LGA compatible
， Supports advanced semiconductor technologies
Features
， Optical properties are characterized by a glass cover with a
transmittance of
91.2% in the 350-900nm range
， Custom package size and pin count
， Extremely accurate die rotation control during assembly (max.
<＼ 0.01 ＜)
， Precise die tilt control of <0.5mil during assembly.
， Termination type: BGA or LGA |
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ShellUT is appropriate for a wide variety of applications,
including:
- Cellular phones and camera phones
- Computing devices
- Digital cameras
- Bar code readers
- Digital scanners
- Fax machines and digital copiers
- Medical devices
- Machine vision
- CD/DVD portable units
- Fingerprint identification
- Toys
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ShellOP